Título

Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel

Autor

HECTOR MANUEL HERNANDEZ GARCIA

RITA MUÑOZ ARROYO

JORGE LEOBARDO ACEVEDO DAVILA

FELIPE DE JESUS GARCIA VAZQUEZ

FELIPE ARTURO REYES VALDES

Nivel de Acceso

Acceso Abierto

Licencia

http://creativecommons.org/licenses/by-nc-nd/4.0

Materias

Nanopartículas - (AUTOR) INGENIERÍA Y TECNOLOGÍA - (CTI) CIENCIAS TECNOLÓGICAS - (CTI) TECNOLOGÍA METALÚRGICA - (CTI)

Resumen o descripción

Transient liquid phase (TLP) bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to

study the influence of silicon nanoparticles (NPs) on the mechanical and structural properties of the bonding area.

It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP

induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area.

Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to

microhardness measurements, which are lower when the silicon NPs are used in the brazing process.

Fecha de publicación

2014

Tipo de publicación

Artículo

Versión de la publicación

Versión publicada

Recurso de información

http://comimsa.repositorioinstitucional.mx/jspui/handle/1022/139

Formato

application/pdf

Idioma

Inglés

Sugerencia de citación

H.M. Hdz-García, A.I. Martinez, R. Muñoz-Arroyo, J.L. Acevedo-Dávila, F. García-Vázquez, F.A. Reyes-Valdes. (2014) Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304Stainless Steel. Elsevier. J. Mater. Sci. Technol., 2014, 30(3), 259e262.

Repositorio Orígen

COMIMSA

Descargas

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